Systems Intern - Validation, Software, Design, Architecture & Packaging (USA)

Required

• Currently pursuing a BS, MS, or PhD in EE, Computer Engineering, Computer Science or Mechanical Engineering
• Coursework or projects in embedded systems, microwave and signal integrity, board-level design, or thermal/mechanical engineering using low-level programming (C/C++, Python) or hardware design and/or simulation tools (e.g., CAD, FEA, Verilog).
• Problem solver with strong foundational knowledge in one of these areas: electrical engineering, digital logic, computer architecture, or thermal/mechanical.
• Curious learner who is passionate about the intersection of software, silicon architecture, and the physical constraints of chip packaging and printed circuit boards (PCBs).
• Systems & Silicon Validation: Assist in post-silicon testing of physical microchips under real-world workloads to ensure they meet all functional, electrical, and performance specifications.
• System Software: Contribute to developing foundational software—including firmware, drivers, and operating systems—that directly controls and interfaces with the semiconductor hardware.
• System Design & Architecture: Help map out, define, and evaluate high-level structural frameworks, optimizing the power delivery and high-speed performance benchmarks of both the silicon components and the underlying PCBs.
• Semiconductor Packaging & Mechanical Design: Design and layout, Electromagnetic (signal integrity and power integrity), mechanical design, and stress analysis
• What You Will Learn
• Hands-on silicon experience using industry-standard lab equipment to bridge the gap between theoretical hardware design, physical packaging layouts, and real-world chips.
• Low-level software development by writing production-grade firmware, device drivers, and diagnostic tools that run directly on bare metal.
• Mechanical & thermal engineering for electronics by learning how structural stress, heat dissipation, thermal expansion, and mechanical shock affect the structural integrity and performance of PCBs and packages.