PCB Designer

Torrance, CAfull timeOn Site

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mid

$79k–$99k

H1B: no

NorthwoodSpace Own the physical layout of complex, high-density PCBs at NorthwoodSpace, establishing PCB design standards and workflows. Collaborate with Electrical, RF, and Antenna engineers from concept to production.

Responsibilities

Own the physical layout of complex, high-density, high-layer-count PCBs featuring high-speed, high-frequency digital, RF, mixed-signal, and power distribution systems.
Determine optimum layer stackups, perform component placement, routing feasibility studies, and manage strict high-speed/high-frequency constraint rules.
Perform ECAD library creation, management, and maintenance for a wide array of active, passive, and high-pin-count components.
Collaborate across hardware and production teams to ensure strict adherence to Design for Manufacturability (DFM), Design for Assembly (DFA), and Design for Test (DFT) guidelines.
Generate and release comprehensive documentation packages for fabrication and assembly (Gerbers, ODB++, IPC-2581, drill charts, fabrication drawings).
Work closely with external PCB fabrication and assembly vendors to resolve technical queries (EQs) and continuously improve internal design rules.
Evaluate, select, and champion advanced PCB design tools and automation scripts to establish the technical groundwork for scaling the layout function as the team grows.
Serve as the internal authority on high-speed and high-frequency layout practices, mentoring engineers across disciplines on layout-aware design.

Qualification

Strong command of PCB materials

Required

2+ years of professional experience in complex, high-density PCB layout, with demonstrated ownership of high-speed and high-frequency designs end-to-end (or a Bachelor's degree in Electrical Engineering/related field with 6+ years of relevant experience).
Hands-on expertise in high-speed and high-frequency layout techniques (impedance control, differential pairs, length matching, crosstalk mitigation, and RF-aware routing).
Proven experience with advanced packaging technologies, including fine-pitch BGAs, high-pin-density components, and micro-vias (HDI).
Strong command of PCB materials, dielectric properties, and developing multi-layer board stack-ups for high-frequency performance.
Demonstrated experience applying EMI/EMC mitigation techniques and designing robust power delivery networks (PDN) at the board level.
Track record of operating with significant autonomy, able to set direction and make final layout calls with minimal oversight.

Preferred

2+ years of experience designing high-speed, high-frequency, mixed-signal PCBs for FPGA, processor, RF/antenna, or high-performance networking systems.
Experience with routing high-speed interfaces such as multi-gigabit SerDes, DDR memory, JESD204B/C, and 10/100G Ethernet.
Proficiency in industry-standard ECAD tools (Altium Designer, Cadence Allegro, or Siemens Xpedition).
Strong understanding of IPC standards (e.g., IPC-2221, IPC-7351) and commercial manufacturing tolerances.
Experience with ECAD/MCAD co-design and integration workflows (e.g., SolidWorks, STEP files) for tight mechanical constraints.
Experience with scripting or automation (e.g., Python, Skill, or Altium scripts) to optimize layout workflows.
Prior experience building or scaling a PCB layout function, standards library, or design process from scratch.
Excellent communication skills and a proven ability to make sound layout tradeoffs in a fast-paced, collaborative hardware environment.