As an Optomechanical Engineer at fab2, you’ll work with a full-stack team to develop the complete set of tools and processes for fabricating semiconductor packaging devices.
We are seeking a hands-on engineer with deep expertise in designing laser-based systems and a passion for exploring new technologies. This person will play a critical role in developing hardware and optimizing processes that create innovative packaging solutions, ensuring they meet performance, reliability, and manufacturability requirements. The ideal candidate will have a broad skill set and be open-minded about integrating novel methods into semiconductor packaging processes.
Own optomechanical system development from concept through operation, including mechanical design, optical layout, precision assembly, wiring, controls integration, alignment, and debug.
Develop laser micromachining processes and equipment, including vision-based alignment and inspection systems.
Create and validate novel IC packaging processes, from early experiments through repeatable multi-step process flows.
Plan and execute experiments across deposition, etch, lithography, bonding, die attach, and related packaging processes.
Collaborate closely with process, mechanical, electrical, controls, and software engineers to move quickly from concept to working hardware.
Create and maintain design documentation, experiment records, operating procedures, and equipment maintenance requirements for safe, reliable, and repeatable operation.
Required Experience
Hands-on experience designing, building, integrating, or fundamentally modifying process equipment or scientific instruments
Experience with optomechanical system design and integration, including mechanical design, optics, precision assembly, wiring, controls, alignment, and system debug
Experience developing laser micromachining processes and working with vision-based alignment systems
