We’re hiring Semiconductor Packaging Engineering Interns for the summer term. The internship begins in May or June, with a preferred commitment of 4 to 8 months. We are a small team engaged in end-to-end process development and integration work for semiconductor packaging processes, providing exposure to interesting work that is hard to find at larger companies. This is a hands-on engineering role—meaning you will be actively involved in the research and development of new packaging technologies, including mechanical prototyping, experiment design, and data analysis. We train our interns on most of our tools and allow them to use these tools independently, including 3d printing, metal plating, lasering, and metrology.
Our philosophy is to get things built and tested in days or weeks, not months. Because of this, a portfolio is required to apply: show us the things you’ve actually built! If you’ve shipped a medium-to-high complexity system through a personal project or previous internship, you’d be a good fit here.
Design and iterate on machines and subsystems for semiconductor packaging fabrication, such as laser ablation machines, reflow ovens, and automated metal plating facilities
Integrate mechanical, electrical, and optical components in system assembly, including wiring, optics alignment, and electronics
Collaborate with cross-functional teams to continuously improve fabrication processes and equipment
Hands-on package/wafer processing (3d printing, metal plating, lithography, metrology)
Required Experience
Pursuing a Bachelor’s Degree or higher in engineering
At least 1-2 hands-on wet lab or lab-adjacent experiences, ideally in metal plating work or fabricating devices
Strong foundation in mechanical engineering (Solidworks/Onshape, materials selection, etc.)
Hands-on prototyping experience and the ability to move through design cycles quickly
Proven experience in mechatronics or electromechanical system design
