Principal ASIC Design Engineer - Chip Lead

Please Note: To conform with the United States Government Space Technology Export Regulations, the applicant must be a U.S. citizen, lawful permanent resident of the U.S., conditional resident, asylee or refugee (protected individuals as defined by 8 U.S.C. 1324b(a)(3)), or eligible to obtain the required authorizations from the U.S. Department of State. This position is with Jariet Technologies, Inc., a subsidiary of CesiumAstro. Jariet is developing breakthrough technologies to permit digital communications technology to be applied at micro/mm-Wave speeds using standard CMOS processes. Jariet is well positioned to provide ASIC products into emerging markets in multi-antenna beamforming communications systems and wireless infrastructure as well as digital deployments into microwave point-to-point links and radar systems. We are actively seeking passionate, collaborative, energetic, and forward-thinking individuals to join our team. We are looking to add a Principal ASIC Design Engineer - Chip Lead for our next generation industry leading high speed mixed signal/DSP projects. We are specifically looking for someone with cradle-to-grave experience who knows all levels of large, high-speed communications chip design. The ideal candidate will have knowledge in all or most of the following areas: digital communications systems, DSP, ASIC microacrchitecture, analog IP integration, embedded processors, high level verification, RTL design with multiple asynchronous clock domains, timing analysis, DFT, backend flow, chip bring up, debug, lab testing, and transitioning a product from first sample through release to volume production.