Hpiq Product Design Engineering Intern at HP IQ's Hardware Design team responsible for mechanical design and systems integration of hardware products. Collaborate across disciplines to drive design from prototype to production ramp.
Responsibilities
HP IQ's Hardware Design team is responsible for materializing product vision into manufacturable hardware systems. Working closely with Industrial Design, System Software, Electrical Engineering, and Manufacturing partners, this role drives the design and integration of complete hardware products from early architecture and prototype phases through production ramp. The position offers the opportunity to own the mechanical and systems integration challenges that transform concepts into shipping products.
What You Might Do
Collaborate with Industrial Design to translate product vision into mechanical design, enclosure layout, and form factor feasibility
Integrate multiple subsystems (microphone, speaker, antenna, battery, PCB, sensors, buttons) into a cohesive hardware architecture
Produce CAD models, component placement studies, and tolerance analysis to guide manufacturing
Work with contract manufacturers and vendors to validate design feasibility, manage drawing releases, and troubleshoot production issues
Participate in hands-on prototype builds, design validation, and iterative refinement across development cycles
Apply design of experiments methodology to validate material selection, assembly processes, and design assumptions
Collaborate with Electrical Engineering on PCB layout, flexible PCB integration, and component placement constraints
Define assembly processes, fixturing strategies, and datuming schemes to ensure manufacturability
Own design documentation including 2D drawings, specifications, and design rationale for internal and vendor communication
Essential Qualifications
Qualification
Familiarity with tolerance analysisExperience with assembly process design2027 Internship Program Dates
Required
Solid understanding of material science fundamentals including stress-strain relationships and thermal properties
Proficiency with CAD tools and component placement within constrained form factors
Familiarity with tolerance analysis, tolerance stacks, and design for manufacturability principles
Experience or knowledge of manufacturing processes including injection molding and CNC machining
Preferred
Minimum 1-2 years of hardware product design or related experience; prior internship at a consumer electronics company is preferred
Experience communicating with contract manufacturers or FATP (final assembly) partners
Exposure to design of experiments (DOE) or design validation methodologies
Portfolio demonstrating complete hardware projects from design through prototype or production
Experience with assembly process design, datuming, and fixturing
Familiarity with cross-functional product development from concept through production ramp
2027 Internship Program Dates: May/June–August/September 2027. Final dates will be based on student schedules.
