Micro-electronics Technician

Required

• High School Diploma or equivalent. Candidates should possess hands-on experience in wire bonding or microelectronic manufacturing OR demonstrate equivalent practical skills gained from a technical bootcamp or certification program in a related field.
• Proven proficiency in various wire bonding techniques (manual gold ball, wedge, ribbon; semi-automatic; automated) and intricate microelectronic assembly, including precise adhesive and epoxy application.
• Exceptional manual dexterity and the ability to work consistently and accurately under a microscope for an entire shift.
• Strong ability to read, interpret, and follow detailed technical documentation such as build sheets, ICDs, and engineering drawings, coupled with a commitment to maintaining a clean, safe, and ESD-compliant work environment.
• Must be a U.S. Person due to required access to U.S. export controlled information or facilities
• The salary range for this role is an estimate based on a wide range of compensation factors, inclusive of base salary only. Actual salary offer may vary based on (but not limited to) work experience, education and/or training, critical skills, and/or business considerations. Highly competitive equity grants are included in the majority of full time offers; and are considered part of Anduril's total compensation package. Additionally, Anduril offers top-tier benefits for full-time employees, including: