Tenstorrent Global Supply Chain Manager at Tenstorrent to own OSAT partnerships and backend manufacturing execution. Responsible for supply continuity from wafer-out through final shipment with Taiwan-based OSAT partners.
Responsibilities
Lead OSAT supplier relationships, QBRs, KPI reviews, escalations, and commercial negotiations
Coordinate engineering builds, qualification lots, process readiness, yield ramps, demand, capacity, materials, and production schedules across OSAT partners
Manage backend operations including bumping, assembly, burn-in, final test, and system-level test for advanced packaging and multi-die products
Own substrate and critical-material sourcing including capacity, pricing, tooling, lead-time risk, and high-density substrate requirements for HBM and AI compute products
Resolve supply, quality, yield, logistics, and schedule risks while establishing reliable OSAT data, KPIs, and processes to support analytics and automation
Qualification
Are a clearAre a structuredLead OSAT supplier relationshipsCoordinate engineering buildsResolve supplyWhat You Will LearnMandarin fluency
Required
Bring 7+ years of experience in semiconductor supply chain, manufacturing, or supplier management, along with a bachelor’s degree in Supply Chain, Engineering, or a related discipline.
Have a strong understanding of OSAT workflows, including flip-chip, wire bond, and wafer-level packaging, with hands-on experience working with Taiwan-based OSAT partners.
Are comfortable negotiating complex supplier agreements, pricing, tooling, or NRE costs and managing relationships across technical, commercial, and operational issues.
Are a clear, direct, and trusted communicator who can work effectively across global teams, suppliers, and North American and Asia-Pacific time zones; Mandarin fluency is a plus.
Are a structured, data-driven operator with experience using ERP systems such as SAP or Oracle, PLM systems, and reporting tools such as Tableau or Power BI, and you take ownership in ambiguous situations.
Lead OSAT supplier relationships, QBRs, KPI reviews, escalations, and commercial negotiations while building trust and holding partners accountable.
Coordinate engineering builds, qualification lots, process readiness, yield ramps, demand, capacity, materials, and production schedules across OSAT partners.
Manage backend operations including bumping, assembly, burn-in, final test, and system-level test for advanced packaging and multi-die products.
Own substrate and critical-material sourcing, including capacity, pricing, tooling, lead-time risk, and high-density substrate requirements for HBM and AI compute products.
Resolve supply, quality, yield, logistics, and schedule risks while establishing reliable OSAT data, KPIs, and processes to support analytics and automation.
What You Will Learn
How advanced AI hardware moves from wafer fabrication through packaged silicon delivery.