Thermal Mechanical Test Engineer, Silicon Packaging (Starlink)

Bastrop, TXfull time

On Site

entry

H1B: no

SpaceX Thermal Mechanical Test Engineer for Silicon Packaging at SpaceX responsible for developing and executing thermal and mechanical modeling and test programs for semiconductor packaging. Supports production by characterizing thermal performance and validating mechanical robustness.

Responsibilities

Develop and run thermal and mechanical finite element models, and thermal simulations, to predict package and board-level behavior under operational and environmental conditions
Develop process models to support new production line bring-up and investigations into packaging processes
Design, set up, and execute thermal and mechanical test campaigns
Perform board-level thermal characterization and testing to evaluate heat spreading, junction temperatures, and system-level thermal performance
Operate and maintain thermal and mechanical test equipment, such as thermal chambers, along with instrumentation, including thermocouples and infrared cameras
Analyze test data, correlate models with empirical results, and provide actionable feedback to packaging, silicon design, and manufacturing teams
Support new package and board designs through test planning, execution, and data reporting
Collaborate cross-functionally with packaging process engineers, hardware design teams, production operations, and quality to integrate test insights into product development and production ramp

Qualification

Bachelor’s degree in an engineeringBachelor’s in mechanical engineeringAdvanced degree in an engineering

Required

Bachelor’s degree in an engineering, math, or science discipline
1+ years of experience with thermal or mechanical modeling and testing in an industry or academic setting

Preferred

Bachelor’s in mechanical engineering, materials science, aerospace engineering, physics, applied mathematics, or other STEM discipline
Advanced degree in an engineering, math, or science discipline
Experience with board-level thermal testing and characterization using thermocouple mapping, power dissipation testing, or infrared thermography
Experience using finite element analysis or thermal simulation tools such as ANSYS, Abaqus, COMSOL, Flotherm, or Icepak
Experience with 3D and reduced-order thermal and mechanical modeling
Experience correlating simulation models with physical test data
Experience in simulation and characterization of IC packaging thermal resistance parameters
Proficiency in Python or MATLAB for data analysis and post-processing