Test Technician, Silicon Assembly (Starlink)

Bastrop, TXfull time

On Site

mid

H1B: no

SpaceX Test Technician for Silicon Assembly at Starlink responsible for test program development, wafer-level and package-level RF testing, and collaboration with engineering teams to ensure product quality. Maintains test equipment and adheres to cleanroom and safety protocols.

Responsibilities

Partner with the engineering team on integration & process of record (POR) definition
Perform recipe development, automated equipment programming, and validation
Perform wafer-level probing and testing using DC/RF probe stations, parametric analyzers, and vector network analyzers (VNAs) to measure I-V characteristics, capacitance, RF insertion loss, and return loss on individual dies
Execute package-level RF testing on assembled devices, including high-frequency characterization up to mm Wave bands, utilizing test sockets, handlers, and ATE systems to validate gain, linearity, and power handling
Develop and optimize test programs and recipes, scripting in languages like Python or LabVIEW to automate data collection, statistical analysis, and binning for yield optimization
Analyze test data for outliers, process excursions, and correlations using SPC tools, generating reports on key metrics such as test time, defect maps, and RF performance distributions
Collaborate with design, process, and packaging teams to debug failures, qualify new test hardware, and integrate testing into the full product lifecycle from wafer sort to final package validation
Maintain test equipment through calibration, preventive maintenance, and troubleshooting to ensure measurement accuracy and minimize downtime in a high-throughput environment
Adhere to cleanroom protocols, ESD safeguards, and safety standards for handling RF components and high-power test signals

Qualification

Bachelor's degree in an engineeringProficiency with RF test equipmentADDITIONAL REQUIREMENTS

Required

High school diploma or equivalency certificate
3+ years of professional experience in a hands-on manufacturing environment; OR bachelor's degree in an engineering, math or science discipline

Preferred

Bachelor's degree in an engineering, math or science discipline
6+ years of experience in wafer probing or RF package testing within a semiconductor manufacturing or test environment
Thorough knowledge of electrical theory including digital, analog, and RF circuitry
Proficiency with RF test equipment, including VNAs, spectrum analyzers, oscilloscopes, along with the understanding of semiconductor device physics and RF parameters
Strong skills in test automation and data analysis software (e.g., Excel, JMP, or Python) for SPC, yield modeling, and failure diagnostics
Ability to fabricate and repair cable harnesses including: soldering, crimping, assembling connectors for bench testing, debugging & failure analysis; J-STD-001 certification is a plus
Excellent manual dexterity and the ability to perform bench top testing/manual probing under microscope
ADDITIONAL REQUIREMENTS: