SpaceX Failure Analysis Engineer for Starlink performing root cause failure analysis on microelectronic components to improve reliability of satellite constellation and user terminals. Uses advanced lab tools and physics-of-failure techniques.
Responsibilities
Own end-to-end root cause failure analysis investigations on microelectronics failing in manufacturing, test, and field, from initial failure characterization through final corrective action verification
Conduct advanced electrical fault isolation and characterization using curve trace, TDR, RF characterization, Lock-in Thermography, OBIRCH, EBIRCH, EBAC, nanoprobing, and related techniques to precisely localize defects in complex devices
Perform advanced physical failure analysis using SEM, FIB, EDS, SAM, cross-sectioning, and related techniques to identify failure mechanisms in silicon, packaging, and interconnects
Apply physics-of-failure principles and deep knowledge of semiconductor failure modes (electromigration, thermal fatigue, delamination, EOS/ESD, solder joint fatigue, etc.) to determine root causes
Drive corrective actions by working directly with silicon design, packaging, and manufacturing teams to implement and validate design or process changes based on FA findings
Author detailed technical reports documenting failure modes, root cause conclusions, supporting data, and corrective action effectiveness
Develop and improve failure analysis techniques and workflows to support new packaging technologies and advanced materials
Qualification
Bachelor’s degree in materials scienceMaster’s or PhD in materials scienceExcellent problem-solving
Required
Bachelor’s degree in materials science, electrical engineering, physics, chemical engineering, or other STEM discipline
2+ years of hands-on experience in microelectronics failure analysis or materials characterization (internship experience is applicable)
Preferred
Master’s or PhD in materials science, electrical engineering, physics, chemical engineering, or other STEM discipline with a focus on microelectronics or failure analysis
Direct experience with failure analysis tools and techniques (SEM, FIB, EDS, cross-sectioning, fault isolation, or equivalent)
Strong understanding of semiconductor physics and common microelectronics failure mechanisms (electromigration, thermal fatigue, delamination, solder joint fatigue, electrical overstress/ESD, etc.)
Proficiency with advanced FA tools including SEM, FIB, SAM, and EDS
Hands-on experience in electrical characterization and fault isolation techniques such as IV curves, RF/VNA measurement, LIT, OBIRCH, EBIRCH, EBAC, nanoprobing, photon emission, or voltage contrast
Experience applying JEDEC and AEC reliability test standards and physics-of-failure methodologies to root cause investigations
Experience analyzing complex datasets with Python, JMP, or similar tools
Excellent problem-solving, communication, and technical writing skills
