Silicon Packaging Technician, Silicon Assembly (Starlink)

Bastrop, TXfull time

On Site

mid

H1B: no

SpaceX Silicon Packaging Technician for Silicon Assembly in Starlink responsible for operating and maintaining deposition, photolithography, dicing, die attach, and electrochemical plating equipment. Ensures process performance and compliance with cleanroom and safety standards.

Responsibilities

Operate and maintain deposition systems, including physical vapor deposition (PVD) to deposit precise thin films of metals & dielectrics as well as stripping and etching equipment
Operate photolithography tools, such as photoresist coaters, aligners, steppers, scanners, and developers, to apply uniform resist layers, align products, expose patterns, and develop images with precision accuracy
Monitor process performance using in-situ sensors and metrology equipment like 3D profilometers, ellipsometers, reflectometers, and X-ray fluorescence (XRF) to ensure film uniformity, step coverage, and contamination control
Operate dicing saws, laser dicers, and plasma etching tools to perform mechanical, laser, or plasma-based singulation on wafers and large-format panels, following & monitoring recipes
Load and unload materials into molding systems, following recipes to achieve target mold fill, void minimization, and flash control during production runs
Operate die attach equipment, including epoxy dispensers, pick-and-place bonders, and reflow stations, to place and secure dies with micron-level accuracy and controlled bond line thickness
Operate electrochemical plating tools, including copper electroplaters and seed layer systems, and stripping/etch equipment to process products according to recipes for uniform deposition and precise material removal rates.
Comply with cleanroom gowning protocols (ISO), Chemical Safety Standards, & Strict Electrostatic Discharge (ESD) guidelines

Qualification

Bachelor's degree in materials scienceADDITIONAL REQUIREMENTS

Required

High school diploma or equivalency certificate
3+ years of professional experience in a hands-on manufacturing environment; OR associate's degree in an engineering, math or science discipline

Preferred

Bachelor's degree in materials science, electrical engineering, or a related field
6+ years of practical experience in high volume semiconductor manufacturing operations
Proficiency and experience in photolithography (e.g. align, bake, coat, expose, develop), electrochemical plating, die Attach, thermal compression bonding, compression molding/overmold, wafer dicing, scribe & break, stripping/etching, plasma, reactive ion etching (RIE), thin films deposition (CVD/PVD/ALD), dry film lamination & imaging
Proficiency in data analysis and process control software for statistical process control (SPC)
Physical stamina to manage equipment in a cleanroom suit and handle sensitive substrates
Experience with metrology tools such as confocal scanning acoustic microscopy(C-SAM), 3D profilometers, stereoscopes, optical tensiometers (goniometer), X-Ray fluorescence (XRF)
Excellent manual dexterity with the ability to work with both hands under a microscope
ADDITIONAL REQUIREMENTS: