Sr. Silicon Packaging Process Engineer, Silicon Technology (Starlink)

Bastrop, TXfull time

On Site

senior

H1B: no

SpaceX Sr. Silicon Packaging Process Engineer owns packaging assembly processes from concept to mass production for Starlink silicon technology. The role involves developing new technologies and managing equipment and materials for semiconductor packaging.

Responsibilities

Own packaging assembly processes from concept to mass production, including equipment and material selection for wafer-level and chip-level systems
Develop new technologies and establish baselines for assembly and packaging, including wafer grinding, wafer dicing, lithography, lamination, plating, etching, SMT, flip chip, bonding, molding, underfill, dispense, sputter, lid attach, and solder ball attach, and next-generation panel-level packaging processes
Bring-up for new product introduction (NPI) and new technology introduction (NTI) for assembly packaging lines
Own packaging prototypes, product development, and release to production
Select equipment and material to meet quality, reliability, cost, yield, and production targets
Interface with equipment and material suppliers including continuous improvement plans, cost reduction, and productivity improvements
Cross-functional interface with silicon design, materials, thermal, systems, and production teams
Implement advanced packaging solutions into SpaceX next generation products on Earth, in orbit, and beyond

Qualification

Advanced technical degreeHands-on packagingADDITIONAL REQUIREMENTSITAR REQUIREMENTSTo conform to U

Required

Bachelor’s degree in electrical engineering, mechanical engineering, chemical engineering, materials science, physics, or other engineering discipline
1+ years working with semiconductor packaging processing equipment, silicon, microelectronics, or packaging design (internship experience applicable)

Preferred

Advanced technical degree
3+ years industry experience with microelectronics packaging development
Hands-on packaging, PCB, PCBA, or SMT assembly experience
OSAT (outsource semiconductor assembly and test) experience
ADDITIONAL REQUIREMENTS:
Ability to work extended hours or weekends as needed for mission critical deadlines
ITAR REQUIREMENTS:
To conform to U.S. Government export regulations, applicant must be a (i) U.S. citizen or national, (ii) U.S. lawful, permanent resident (aka green card holder), (iii) Refugee under 8 U.S.C. § 1157, or (iv) Asylee under 8 U.S.C. § 1158, or be eligible to obtain the required authorizations from the U.S. Department of State. Learn more about the ITAR here.