Determine layer stack-up, perform component package selection, component placement, routing feasibility studies, and signal routing of digital, analog, RF, and power conversion of printed circuit boards (PCB)
Conduct pre- and post-layout SI/PI simulations to mitigate crosstalk, reflections, and EMI/EMC issues
Perform DRC/ERC checks, peer reviews, and design audits; collaborate with hardware/firmware engineers for functional validation and prototype bring-up support
Analyze designs for manufacturability; incorporate production feedback from fabrication houses and assembly partners to reduce costs and improve yield
Collaborate with internal teams and PCB vendors to continually improve design rules, constraints and design for test and manufacture guidelines
Customize and verify symbols, footprints, and 3D models; interface with PCB librarians for new parts and resolve library discrepancies
Work with mechanical, thermal, RF, and test engineers on stack-up planning, thermal vias, shielding, and enclosure integration; participate in design reviews and risk assessments
Assist our librarians in creating, updating, and maintaining accurate PCB component libraries including symbols, footprints, 3D STEP models, and parametric data in CAD tools like Altium and Xpedition
Drive the future roadmap for SpaceX to incorporate custom AI tools to radically improve the efficiency of PCB design tasks
Qualification
Proficiency in Python
Required
Bachelor’s degree in electrical engineering OR 3+ years of professional experience with PCB layout in lieu of a degree (internships and club/project work applies)
Preferred
2+ years of experience with PCB layout and routing in one or all of the following areas: modern passive and active electronics components, surface-mount, RF components, ball-grid array and similar fine pitch, or high pin density components
1+ years of experience with ECAD libraries and library configuration management
Demonstrated understanding of design for manufacturability, assembly, and test
Experience with Mentor Xpedition and/or Altium Designer (Mentor Xpedition preferred)
Experience with layout of mixed analog and digital designs, high speed buses, FPGA, DRAM and CPU designs, power supplies, DC-DC converters, transmission lines, impedance-controlled traces and power traces
Proficiency in generating fabrication outputs (Gerber, ODB++, IPC-2581, drill files), DFM/DFA analysis, constraint-driven design, and collaboration with libraries (symbols, footprints, 3D models)
Ability to visualize component placement and interconnectivity
Proficiency in Python, Altium/Mentor Xpedition scripting, or similar for automating library tasks, data extraction, and validation
