Lead SI/PI Engineer

Sunnyvale, CA · Remotefull timeRemote

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senior

$220k–$250k

H1B: yes

Cerebras Lead SI/PI Engineer at Cerebras solves complex signal integrity and power integrity challenges in next-generation AI compute systems. The role involves advanced pre-layout and post-layout SI/PI analysis across PCBs, flex circuits, rigid-flex assemblies, connectors, and advanced packaging.

Responsibilities

Solve complex signal integrity and power integrity problems for high‐speed AI compute platforms, including chip‐to‐chip and chip‐to‐board interfaces.
Perform advanced pre‐layout and post‐layout SI/PI analysis across PCBs, flex circuits, rigid‐flex assemblies, connectors, and advanced packages.
Lead root‐cause analysis of challenging SI/PI issues such as margin shortfalls, impedance discontinuities, coupling, resonances, and simulation‐to‐hardware mismatches.
Analyze and resolve SI/PI challenges associated with flex circuits, high‐speed flex connectors, interposers, and advanced packaging technologies.
Analyze and troubleshoot power delivery networks using DC and AC simulations and hardware correlation to resolve performance and stability issues.
Define and refine PCB, rigid‐flex, and flex circuit stack‐ups, material selections, and impedance structures as required to meet performance targets.
Review schematics, PCB layouts, and flex designs to identify SI/PI risks and recommend targeted design changes.
Work closely with silicon and package design teams to resolve SI/PI issues related to bump/ball assignments, package‐to‐PCB transitions, and interface interactions.
Act as a technical escalation point for complex SI/PI issues across multiple programs.

Qualification

Required Experience and SkillsStrong hands‐on experience with PCBPower delivery network analysisExperience working on server hardwareAdditional Information

Required

Master’s degree in Electrical Engineering.
15+ years of demonstrated depth of expertise in system-level signal integrity and power integrity engineering for high‐speed hardware systems.
Required Experience and Skills:
Deep expertise in high‐speed serial and parallel interface analysis and debug.
Strong hands‐on experience with PCB, rigid‐flex, and flex circuit stack‐up design and analysis.
Advanced SI/PI analysis of flex connectors, high‐density interconnects, and advanced packaging technologies.
Proficiency with 2D and 3D electromagnetic simulation tools.
Power delivery network analysis, simulation, and lab correlation at the system level.
Strong grounding in transmission line theory, microwave engineering, and high‐speed design fundamentals.
Proven ability to correlate simulation results with hardware behavior and drive concrete design fixes.
-Experience working on server hardware, AI accelerators, hardware accelerator, datacenter, AI Hardware, enterprise product, GPU, CPU, TPU, server platform etc.
Additional Information: