Responsibilities

Samsung’s Power & Thermal Lab is seeking a thermal engineering intern to help build and calibrate models of HBM stacks and package.
We are a small, fast‐moving team where direct ownership and minimal busywork empower every member to tackle the same real‐world problems. Working with authentic data, real partners, and production‐grade results, our contributions flow straight into platforms used across the company.
As an intern, the models you build feed design discussions for future HBM products. You will work on real projects with tangible results, receive mentorship, and help shape the scope of work in a collaborative environment where hardware, software, and thermal experts work side‐by‐side on next‐generation AI memory technologies.
Location: Daily onsite presence at our San Jose headquarters in alignment with our Flexible Work policy
Reports to: SVP, R&D (Power & Thermal Lab)
Build and calibrate CFD models (Simcenter Flotherm) of HBM stacks and packages under realistic cooling conditions, and use them as the reference for fast models.
Extend our compact thermal model to new stack heights, die configurations, and base-die power, and quantify its accuracy against CFD in both steady state and transient.
Develop homogenization methods that replace fine features (TSV arrays, micro-bump layers, underfill) with effective properties, and establish where they hold and where they break.
Speed up thermal solvers by orders of magnitude through model-order reduction, sparse linear algebra and preconditioning, GPU acceleration, or machine-learning surrogates.
Run transient simulations driven by real AI workload traces, locate spatiotemporal hotspots, and explore thermal-aware policies such as throttling, refresh control, and power-map scheduling.
Evaluate advanced cooling and thermal-interface options (cold plates, two-phase cooling, TIMs, backside cooling) and translate them into boundary conditions and design guidance for HBM.
Couple the thermal model with the lab's trace-driven power simulation engine so that power maps and temperature maps evolve together in time.

Intern, Thermal Modeling & Simulation Engineer (AI Memory / HBM) at Samsung Semiconductor · LumiJobs

Intern, Thermal Modeling & Simulation Engineer (AI Memory / HBM)

Responsibilities

Benefits

Company

Samsung Semiconductor

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