Lead and perform hands-on thermal modeling and analysis for semiconductor packages, advanced packaging, and electronic systems.

Build and analyze detailed models using ANSYS Icepak and Siemens Flotherm, including model setup, boundary conditions, solver execution and post-processing.

Influence the architecture and/or design, materials selection, and structural integrity of the high-performance advanced packaging, and other associated components and collaterals under manufacturing, test, and usage conditions.

Analyze simulation and measurement results to enhance product reliability.

Support Samsung customers throughout the product development cycle, from early thermal architecture and feasibility studies to detailed modeling, optimizations, and design recommendations.

Translate customer requirements and thermal specifications into simulation methodologies.

Develop best known standards and methodologies and create innovative solutions for challenging semiconductor and packaging applications.

Communicate technical findings clearly through engineering reports, presentations and customer reviews.

Stay current with emerging technologies in advanced packaging, HBM, 2.5D/3D integrations, high power computing, and electronics cooling.

PhD in Mechanical Engineering, Thermal/Fluids, or related Physical Science with 10+ years of Industry Experience is preferred.

Experience in the use of CFD tools such as ANSYS Icepak, Flotherm, CELSIUS and analyzing, debugging, and proposing solutions to resolve various electronic packaging issues observed during assembly, reliability and operation. Ability to independently build models, perform analysis, troubleshoot results and develop engineering recommendations.

Strong understanding of heat transfer, fluid mechanics, thermal management, and electronics cooling fundamentals.

Senior Staff Engineer, Thermal Simulation

Responsibilities

Benefits

Company

Samsung Semiconductor

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