Design, validate, and productize high-speed copper and optical connectivity solutions for AI clusters (100k+ GPU scale)

Own vendor due diligence and onboarding for new 1.6T products including AEC and pluggable optical transceivers (DR4/8, FR4) including rigorous bring-up & characterization

Investigate the opportunity for LPO and LRO in our network

Evaluate early co-packaged and near-packaged engines for switches and GPUs

Evaluate and pathfind new interconnect modalities including VCSEL, microLED, THz radio-based solutions to improve network economics and reliability

Work closely with vendors (transceiver, cable, SerDes, DSP, silicon photonics foundries) to influence roadmaps and ensure timely delivery of next-gen solutions

Collaborate with ML training teams to translate workload communication patterns into concrete interconnect topology and optical reconfigurability requirements

Perform system-level simulation of end-to-end fabric performance

Drive failure analysis, root cause, and corrective actions for interconnect-related issues in production clusters through fleet-level metrics gathering and analysis

Contribute to internal tooling and automation for interconnect health monitoring, telemetry, diagnostics, remediation and automated qualification pipelines

Stay current with industry standards (OIF CMIS, IEEE) and emerging technologies (multi-core/hollow-core fiber, 448G SerDes, TFLN, ring resonators)

Network Engineer - ML Infrastructure (High-Speed Interconnects)

Responsibilities

Qualification

Required

Preferred

Benefits

Company

xAI

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