Responsibilities

Astera Labs is seeking a highly experienced Sr. Principal – Technical Category Sourcing Manager – OSAT & Substrate to set and drive global sourcing strategy in partnership with Engineering—owning supplier selection, commercial negotiations, and product cost models across our outsourced semiconductor assembly and test (OSAT), advanced packaging, and package substrate supply base.
This role owns the end-to-end commercial relationship with OSAT partners, substrate suppliers, and their sub-tier raw material sources—from sourcing strategy and RFQ through pricing, contracting, capacity assurance, and cost roadmaps—across advanced packaging platforms including flip-chip BGA, 2.5D/3D integration, chiplet-based multi-chip packages, and high-layer-count ABF substrates.
This is a highly cross-functional role working closely with Package Engineering, Test Engineering, Operations, Quality, Finance, and Legal to secure capacity, qualify new suppliers, and deliver cost and supply-continuity commitments through NPI and high-volume production.
A core focus of this role is staying ahead of the technology pipeline: as our silicon moves to advanced process nodes and increasingly complex multi-chip packages, you will secure the assembly, test, and substrate capability—and the sub-tier raw materials behind it—well before those platforms reach production.
Success in this role requires a strong balance of technical acumen, business savvy, and the ability to execute against strategic objectives—translating engineering requirements into sourcing decisions, and sourcing strategy into measurable cost, capacity, and continuity outcomes.
A Day in the Life
Set and drive global sourcing strategy for OSAT, advanced packaging, and substrates in partnership with Engineering
Lead RFQs, pricing negotiations, and commercial agreements with OSAT and substrate partners
Secure capacity, tooling, and NRE commitments ahead of demand inflection points
Build and maintain product cost models and defend annual cost-reduction roadmaps
Qualify and develop second-source suppliers to de-risk single-source packages
Partner with Package and Test Engineering to source emerging advanced packaging and multi-chip package technologies

Qualification

Bachelor’s degree in EngineeringExperience in AI infrastructure

Required

Bachelor’s degree in Engineering, Supply Chain, Business, or related field
12+ years of experience in strategic sourcing, procurement, or supplier management within semiconductor, OSAT, or electronics manufacturing
Direct category experience sourcing OSAT services (assembly, test) and/or package substrates
Deep working knowledge of advanced packaging technologies (e.g., flip-chip BGA, 2.5D/3D integration, chiplet-based multi-chip packages, high-layer-count ABF substrates) and wafer sort/final test flows
Experience managing sub-tier (n-tier) suppliers and securing constrained raw materials such as ABF film, copper-clad laminate, and copper foil
Experience sourcing for products at advanced process nodes and for new package architectures ahead of production release
Proven track record negotiating complex commercial agreements (LTAs, capacity reservations, pricing, NRE/tooling) with Asia-based suppliers
Proven ability to build and maintain product cost models, should-cost analyses, and total-cost-of-ownership models
Demonstrated balance of technical acumen and business judgment, with a track record of executing against multi-year strategic objectives
Experience with ERP and procurement systems (e.g., SAP, Oracle, NetSuite) and sourcing processes (RFQ, award, supplier qualification)
Excellent cross-functional communication and executive-level stakeholder management skills

Preferred

Advanced degree (MBA or MS in Engineering, Supply Chain, or Business)
Experience in AI infrastructure, cloud hardware, or high-speed interconnect ecosystems
Established relationships across the OSAT and substrate supplier base in Taiwan, Korea, Japan, China, and Southeast Asia
Experience standing up new suppliers and qualifying second sources in a high-growth fabless environment
Familiarity with advanced packaging cost drivers, substrate panel economics, and test-time reduction levers
Exposure to emerging packaging platforms such as panel-level packaging, glass substrates, or co-packaged optics

Principal Sourcing Manager – Silicon Technologies at Astera Labs · LumiJobs

Principal Sourcing Manager – Silicon Technologies

Responsibilities

Qualification

Required

Preferred

Benefits

Company

Astera Labs

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