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Process Engineer, Gold-To-Gold Interconnect & Flip Chip Assembly (Starlink/Akoustis) at SpaceX · LumiJobs

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SpaceX· Posted Nov 2, 2026

Process Engineer, Gold-To-Gold Interconnect & Flip Chip Assembly (Starlink/Akoustis)

Bastrop, TXfull time

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Remote

mid

H1B: no

SpaceX Process Engineer role focused on developing and qualifying Gold-to-Gold Interconnect and thermosonic flip-chip assembly processes. Responsibilities include process optimization, equipment qualification, and driving NPI from prototype through production.

Responsibilities

Develop and qualify GGI and thermosonic flip-chip / die-attach processes, including bond force, temperature, ultrasonic energy, bond time, alignment, parallelism, and tool selection; establish process windows with DOE to control bond integrity, contact resistance, and mechanical strength
Develop gold stud bump, gold bump, and gold-to-gold interconnect processes and evaluate bond quality and process capability
Develop and optimize vacuum mold lamination and related encapsulation (material selection, vacuum, temperature, pressure, time, and cure); troubleshoot voiding, delamination, die shift, warpage, incomplete fill, and bleed
Support related assembly steps as needed: wafer/die handling, placement, plasma/surface cleaning, underfill, reflow, singulation, laser marking, and inspection
Select and characterize assembly materials (adhesives, mold compounds, substrates, interconnect materials) for impact on bond strength, adhesion, thermal performance, warpage, and reliability
Specify, evaluate, install, and qualify assembly equipment (flip-chip bonders, thermosonic bonders, vacuum laminators, plasma, and inspection tools) with suppliers
Run DOEs, capability studies, and SPC on critical parameters; write process specs, work instructions, control plans, FMEAs, and qualification reports
Drive NPI from prototype through qualification and production release; perform root-cause analysis and support failure analysis (X-ray, SAM, optical, cross-section, SEM)
Correlate process settings to electrical, mechanical, and reliability results; apply DFM and own schedules, risks, and production readiness for assigned technologies

Qualification

DOEInspection and metrology (X-ray

Required

Bachelor's degree in chemical engineering, materials science, mechanical engineering, or other engineering discipline
2+ years of hands-on semiconductor assembly, IC packaging, or electronics manufacturing experience (Internship or extracurricular experience is applicable)

Preferred

3+ years of hands-on IC assembly or advanced packaging experience, including direct GGI or similar gold-based interconnect work
Hands-on thermosonic flip-chip bonding (force, temperature, ultrasonic power, time, alignment, tooling) and gold stud bumping, gold bumps, or gold-to-gold interfaces
Vacuum mold lamination or advanced encapsulation with mold sheets, thermally conductive or epoxy molding compounds, or underfills
Understanding of plasma/surface preparation, organic/ceramic/leadframe/wafer-level substrates, warpage, CTE mismatch, thermal-mechanical stress, adhesion, and delamination
DOE, SPC, Cp/Cpk, root-cause analysis, FMEA, Six Sigma, and control plans
Inspection and metrology (X-ray, SAM, optical microscopy, profilometry, cross-section) and interconnect characterization (contact resistance, shear/pull, bond integrity)
Package reliability testing and standards (JEDEC, IPC), plus experience supporting OSATs or contract manufacturers through development, qualification, and ramp
CAD (AutoCAD) and familiarity with simulation tools (ANSYS, COMSOL, or similar) is a plus; data analysis with JMP, Minitab, MATLAB, or Python is a plus

Company

SpaceX

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Source: greenhouse

Active within the past hour

Remote-friendly

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Must-Have Skills for This Role

Gold-to-Gold Interconnect (GGI)Thermosonic flip-chip bondingDOESPCFMEAX-ray

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