Tenstorrent Senior Physical Design Engineer at Tenstorrent responsible for full-chip implementation of AI and CPU SoC designs. Leads floorplanning, power grid design, and timing closure.
Responsibilities
Drive top-level implementation of complex AI and CPU SoC designs
Collaborate with architecture, RTL, and packaging teams
Optimize chip-level implementations for power, performance, and area
Ensure design closure while maintaining quality and schedules
Qualification
Proven track record with bump planningMastery of timing closureWhat You Will Learn
Required
A seasoned physical design engineer who thrives on complex, full-chip implementation challenges.
Expert at collaborating across disciplines, working effectively with architecture, RTL, and packaging teams.
Passionate about optimizing chip-level implementations for power, performance, and area.
Detail-oriented professional who drives design closure while maintaining quality and meeting aggressive schedules.
8+ years of top-level SOC physical design experience on complex, multi-million gate designs.
Deep expertise in hierarchical floorplanning, fabric implementation, power grid design, and global clock distribution.
Proven track record with bump planning, RDL implementation, and multi-voltage domain designs.
Mastery of timing closure, EM/IR analysis, and physical verification at the chip level.
What You Will Learn
How to implement cutting-edge AI accelerators and high-performance CPUs at the SOC level.
Advanced techniques for chiplet integration and next-generation packaging co-design.
Strategies for optimizing massive designs with complex power domains and clock architectures.